1. k豆钱包

      Manufacturing

       SOIC Series

      Packaging Name Pin Quantity Packaging Size
      (Length*Width)/mm
      Packaging
      Thickness(mm)
      Pin Distance/mm Remarks
      SOIC/8LD 8 4.902x3.937 1.449 1.27  
      SOIC/8LD-3 8 4.902x3.937 1.449 1.27 lack PIN3
      SOIC/8LD-7 8 4.902x3.937 1.449 1.27 lack PIN7
      SOIC-EP/8LD 8 4.902x3.937 1.449 1.27 EDP 3.086x2.20
      FCSOIC/8LD 8 4.902x3.937 1.449 1.27 Flip chip
      SOIC(M)/14LD 14 8.698x3.957 1.449 1.27  
      SOIC(M)/14LD-10~12 14 8.698x3.957 1.449 1.27 lack PIN10-12
      SOIC(M)/14LD-6 14 8.698x3.957 1.449 1.27 lack PIN6
      SOIC(M)/N16LD 16 9.88x3.93 1.449 1.27  
      SOIC(M)/W16LD 16 10.338x7.518 2.318 1.27  
      SOIC(M)/20LD 20 12.789x7.518 2.318 1.27  
      SOIC(M)/24LD 24 15.44x7.518 2.318 1.27  
      SOIC(M)/N28LD 28 17.907x7.493 2.306 1.27  
      SOIC(M)/N28LD-1 28 17.907x7.493 2.306 1.27 lack PIN10-12